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product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays . 1/ 17 tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 01.jun.2016 rev.002 serial - in parallel - out led driver 12 ch led driver ic with 3 - line serial interface b d 8379e fv - m general description the bd 8379 efv -m is a serial - in parallel - out control led led driver with 35v out put voltage rating. with the input of 3 - line serial data , it turns the 12 ch open drain output on/off. due to its compact size , it is optimal for small space. features ? open drain output . ? 3 - line serial control + enable signal . ? cascade connection compatible . ? hts sop - b20 package . ? internal 12 ch power transistor . ? output slew rate typical 20v/ s (for low emc noise) . ? aec - q100 qualified. (note 1) ( note 1 ) grade2 applications ? for indicator of cluster panel . key specification s ? i nput voltage range: 3.0 v to 5.5v ? o utput voltage range: 35v (max.) ? dc output current (per ch): 50m a( max. ) ? output on resistance: 6 (typ.) ? standby current: 0 a (typ .) ? operating temperature range : -40c to + 105 c package w(typ.) x d (typ.) x h (max.) ht ssop -b20 6.50 mm x 6.40mm x 1. 00 mm typical application circ uit fig ure 1 . typical application circuit vcc 10f vbat vcc micro - computer vcc oen_b latch rst_b clk serin serout gnd d0 d1 d2 d3 d4 d5 d6 d7 d0 d1 d2 d3 d4 d5 d6 d7 vcc oen_b latch rst_b clk seri n serout gnd id d8 d9 d10 d11 d8 d9 d10 d11 10f 10f id rl vf rl vf datashee t
2 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 pin configuration s pin descriptio ns figure 2. pin configuration block diagra m f igure 3. block diagram pin no. symbol function 1 vcc power supply voltage input 2 serin serial data input 3 d0 drain output 0 4 d1 drain output 1 5 d2 drain output 2 6 d3 drain output 3 7 d4 drain output 4 8 d5 drain output 5 9 rst_b reset invert input (l ow :ff data 0) 10 oen_b output enable (h igh :output off) 11 serout serial data output 12 latch latch signal input (h igh :data latch) 13 d6 drain output 6 14 d7 drain output 7 15 d8 drain output 8 16 d9 drain output 9 17 d10 drain output 10 18 d11 drain output 11 19 clk clock input 20 gnd gnd - thermal pad back side thermal pad (please connect to gnd) thermal pad 9 o e n _ b ( t o p v i e w ) 1 0 8 7 6 5 4 3 2 1 r s t _ b d 5 d 4 d 3 d 2 d 1 d 0 s e r i n v c c 1 1 1 2 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 g n d c l k d 1 1 d 1 0 d 9 d 8 d 7 d 6 l a t c h s e r o u t s h i f t r e g i s t e r l a t c h & c o n t r o l l o g i c v c c s e r i n c l k s e r o u t l a t c h r s t _ b o e n _ b g n d d 0 d 1 d 2 d 3 d 4 d 5 d 6 d 7 d 8 d 9 d 1 0 d 1 1
3 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 absolute maximum ratings item symbol value unit power supply voltage vcc 7 v output voltage vdmax 35 v input voltage vin - 0.3 to vcc v operating temperature range topr - 40 to +105 c storage temperature range tstg - 55 to +150 c drive current (dc) iomaxd 50 ma drive current (pulse) iomaxp 150 * 1 ma junction temperature tjmax 150 c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore , it is important to consider circuit protection measures , suc h as adding a fuse , in case the ic is operated over the absolute maximum ratings. recommended operating rating s item symbol value unit power supply voltage vcc 3.0 to 5. 5 v operational temperature topr - 40 to 105 c thermal resistance ( note 1) parameter symbol thermal resistance (typ) unit 1s ( note 3 ) 2s2p ( note 4) htssop - b20 junction to ambient j a 143. 0 26.8 c /w junction to top characterization parameter ( note 2 ) jt 8 4 c /w (note 1) based on jesd 51 - 2a (still - air) (note 2) the thermal characterization parameter to report the difference between junction temperature and the temperature at the top c enter of the outside surface of the component package. (note 3) using a pc b board based on jesd 51 - 3. layer number of measurement board material board size single fr - 4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and t races 70 m (note 4) using a pcb bo ard based on jesd 51 - 5 , 7. layer number of measurement board material board size thermal via (note 5) pitch diameter 4 layers fr - 4 114.3mm x 76.2mm x 1.6mmt 1.20mm - 0.30mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 7 4 .2mm 35 m 74.2mm x 7 4 .2mm 70 m (note 5) this thermal via connects with the copper pattern of all layers.
4 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 electrical characteristics (unless specified , ta= - 40 to 105 c v cc = 3.0 to 5.5v) item symbol standard value unit condition min typ max output d0 to d 11 on resistor 1 ron 1 - 6 12 id =20ma , vcc=4.5 to 5.5v on resistor2 ron2 - 9 18 id =20ma , vcc=3.0 to 4.5v output leakage current1 idl1 - - 0.3 a vd =34v , ta= - 40~125 c logic input upper limit threshold voltage 1 vth 1 vcc 0.5 - - v vcc=4.5 to 5.5v upper limit threshold voltage2 vth2 vcc 0.6 - - v vcc=3.0 to 4.5v bottom limit threshold voltage 1 vtl 1 - - vcc 0.2 v vcc=4.5 to 5.5v bottom limit threshold voltage2 vtl2 - - vcc 0.3 v vcc=3.0 to 4.5v oen_b hysteresis width vhys 0.15 0.30 0.50 v vcc=5.0 , oen_b pin serial clock frequency fclk - - 1.25 mhz input leakage current l iinll - 5 0 - a vin=0v input leakage current h iinlh - 0 5 a vin=5v whole circuit current icc - 0. 05 1 ma serial data input , vcc=5v , clk=500khz , vth=vcc , vtl=0v serout=open static current istn - 0 50 a serout=open serout (pin 11) output voltage high 1 voh 1 4.6 4.8 - v vcc=5v , iso= - 4ma output voltage low 1 vol 1 - 0.2 0.4 v vcc=5v , iso=4ma output voltage high2 voh2 2.7 3.0 - v vcc=3.3v , iso= - 4ma output voltage low2 vol2 - 0.3 0.6 v vcc=3.3v , iso=4ma
5 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 typical performance curves ( unless otherwise specified , ta=25 c ) 5.5v 5.0v 105 25 - 40 - 40 25 105 5.0v 5.5v 4.5 v figure 4. circuit current (vcc characteristic) fig ure 5. circuit current (temperature characteristic) fig ure 6. output on resistance (vcc characteristic @ id=20ma) fig ure 7. output on resistance (temperature characteristic @ id=20ma) 0 20 40 60 80 100 0 1 2 3 4 5 supply current 0 2 4 6 8 10 12 3.0 3.5 4.0 4.5 5.0 5.5 supply voltage 0 2 4 6 8 10 12 -40 -15 10 35 60 85 ambient temperature 0 20 40 60 80 100 -40 -15 10 35 60 85 ambient temperature
6 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 4.5v 5.0v 5.5v - 40 25 105 5.5v 5.0v 4.5v 105 25 - 40 fig ure 8. output on resistance (id characteristic) fig ure 9. serout high side voltage (vcc characteristic @ iso= - 4ma) figure 10. serout high side voltage (temperature characteristic @ iso= - 4ma) figure 11. serout low side voltage (vcc characteristic @ iso=4ma) 3.6 v 3.3 v 3.0 v 3.6 v 3.3 v 3.0 v 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -40 -15 10 35 60 85 ambient temperature 0 50 100 150 200 250 300 350 400 10 20 30 40 50 input current 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 3.0 3.5 4.0 4.5 5.0 5.5 supply voltage 0.00 0.05 0.10 0.15 0.20 0.25 0.30 3.0 3.5 4.0 4.5 5.0 5.5 supply voltage
7 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 4.5v 5.0v 5.5v figure 12. serout low side voltage (temperature characteristic @ iso=4ma) 3.3 v 3.0 v 3.6 v 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -40 -15 10 35 60 85 ambient temperature
8 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 serial communication the serial i/f is composed of a shift register which changes the clk and serin serial signals to parallel signals , and a register to store those signals with a latch signal. the registers are reset by applying a voltage below v tl to the rst_b terminal , and d11 to d0 become open. to prevent erroneous led lighting , please apply voltage below v tl to rst_ b during start - up. figure 13. block diagram of serial communication 14) serial communication timing the 12 - bit serial data input from serin is taken into the shift register by the ris ing edge of the clk signal , and is recorded in the register by the ris ing edge of the latch signal. the recorded data is valid until the next ris ing edge of the latch signal. 2 ) serial communication data the serial data input configuration of serin terminal is shown below: first last d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 data terminal output condition data d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 d 11 on 1 * * * * * * * * * * * off 0 * * * * * * * * * * * d 10 on * 1 * * * * * * * * * * off * 0 * * * * * * * * * * d 9 on * * 1 * * * * * * * * * off * * 0 * * * * * * * * * d 8 on * * * 1 * * * * * * * * off * * * 0 * * * * * * * * p p p p p p p p p p p p p p d3 on * * * * * * * * 1 * * * off * * * * * * * * 0 * * * d2 on * * * * * * * * * 1 * * off * * * * * * * * * 0 * * d1 on * * * * * * * * * * 1 * off * * * * * * * * * * 0 * d0 on * * * * * * * * * * * 1 off * * * * * * * * * * * 0 * indicate don ? t care s h i f t r e g i s t e r r e g i s t e r c l k s e r i n l a t c h d r i v e r 1 2 b i t 1 2 b i t
9 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 3 ) enable signal by applying voltage at le ast v th or more to t he oen_b terminal , d11 to d0 become open forcibly. d11 to d0 become pwm operation by having the pwm signal to the oen_b terminal . figure 14. pwm signal 4 ) serout a cascade connection can be made (connecting at least 2 or more ic ? s in serial). serial signal input from serin is transferred into receiver ic by the fall ing edge of the clk signal. since this functionality gives enough margins for the setup time prior to the ris ing edge of the clk signal on the receiver i c (using the exact same clk signal of sender ic) , the application reliability can be improved as cascade c onnection functionality. figure 15. serout output signal cascade connection by using (at least) 2 ics , each ic ? s d 11 to d0 , at (at least) 24ch , can be controlled by the 24 - bit serin signal. the serial data input to the sender ic can be transferred to the receiver ic by inputting 12 clk to the clk terminal. fig ure 16 . cascade connection d 2 3 d 2 2 d 2 1 d 1 4 d 1 3 d 1 2 d 1 1 d 1 0 d 9 d 2 d 1 d 0 l a t c h s e r i n c l k 1 2 3 1 0 1 1 1 2 1 3 1 4 1 5 2 2 2 3 2 4 r e c e i v e s i d e i c s e n d s i d e i c l a t c h s e r i n c l k s e r o u t d 0 d 1 d 2 d 3 d 4 d 5 d 6 d 7 d 8 d 9 d 1 0 d 1 1 d 1 1 2 1 3 4 5 6 7 8 9 1 0 1 1 1 2 oen _ b d 11 to d 0 ( output ) iled vih vil vbat ( input ) led on led off l h off led on led off vol
10 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 input signal t c k 5 0 % 5 0 % c l k s e r i n t s e s t t s e h d t c k h t c k l t l a d z t s e w t l a h 5 0 % l a t c h
11 / 1 7 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 output signal output signals delay time 5 0 % t d o e n h t d o e n l 5 0 % 9 0 % 1 0 % s r r i s e s r f a l l 5 0 % o e n _ b o u t p u t ( d 1 1 t o d 0 ) l a t c h 5 0 % t d l a h o u t p u t ( d 1 1 t o d 0 ) c l k 5 0 % t d s o h t d s o l 5 0 % s e r o u t
12 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 i/o equivalence circuit s 2pin ( serin ) 9 pin ( rst_b ) 10 pin (oen_b ) 12 pin ( latch ) 19 pin (clk) 3pin ( d0 ) , 4pin (d1) , 5pin (d2) , 6pin (d3) , 7pin (d4) , 8pin (d5) , 13pin (d6) , 14pin (d7 ) , 15pin (d8) , 16pin (d9) , 17pin (d10 ) , 18pin (d11) 11 pin (serout) vcc vcc vcc
13 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, co nnect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, e ven during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. t hermal c onsideration should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the boa rd size and copper area to prevent exceeding the maximum junction t emperature rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagneti c f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage.
14 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 operational notes C n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
15 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 ordering informatio n b d 8 3 7 9 e f v m e 2 part number package e fv : ht ssop - b 20 packaging and forming specification m: high reliability e2: embossed tape and reel marking diagram (top view) htssop - b20(top view) b d 8 3 7 9 part number marking lot number 1pin mark
16 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 physical dimension , tape and reel information package name htssop - b20
17 / 17 b d8379efv - m tsz02201 - 0t1t0c500190 - 1 - 2 ? 20 1 6 rohm co. , ltd. all rights reserved. 01.jun.2016 rev.002 www.rohm.com tsz22111 15 001 revision history date revision changes 14 mar . 2016 001 new release of specification. 1 jun . 2016 002 p.3 thermal resistance 2 internal layers / copper pattern , bottom / copper pattern before : 74.2mm 2 (square) after : 74.2mm x 7 4 .2mm
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd8379efv-m package htssop-b20 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd8379efv-m - web page

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